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Contact : Michael Toepper Michael.Toepper@izm.fraunhofer.de |
The Fraunhofer-Gesellschaft (FHG) is one of the leading organisations of applied research in Europe, undertaking contract research on behalf of industry, the service sector and the government. At present, the organisation maintains more than 80 research units, including 56 Fraunhofer Institutes in Germany. A staff of some 13,000, the majority of whom are qualified scientists and engineers, generate the annual research volume of about 1.3 billion Euros. Of this amount, more than one billion Euros is generated through contract research.
With more than 230 employees, the Fraunhofer Institute for Reliability and Microintegration FHG-IZM is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. The institute covers all the competencies needed for advanced packaging concepts such as packaging material science and characterization, package design and simulation, high density interconnect and wafer level packaging, chip and board interconnection technologies, 3D-packaging and vertical chip integration, reliability and failure analysis. The transfer of research results to the industry (small, medium and large enterprises) and the development of custom specific solutions for microelectronic packaging and system integration is one of the main tasks of the institute.
Resources: Fraunhofer IZM operates 2 cleanrooms for wafer level processes, a flip chip line and specific laps for material characterization and reliability assessment.
Oswin Ehrmann is head of the department High Density Interconnect and Waferlevel Packaging (HDIWLP) at the Fraunhofer IZM in Berlin. He obtained a degree in physics from the Technical University of Berlin. He has 23 years of experience in packaging technologies.
Katrin Kaletta is project manager and application engineer. She obtained a degree in electrical engineering from the Technical University of Berlin. She has 12 years of experience in packaging technologies.
